招聘-猎头职位-宝德威企业管理咨询有限公司,天津猎头公司，天津管理咨询

Position	Senior Packaging R&D Engineer
Company Info	A famous American company in semi-conductor fields and locates in Xiqing District.
Responsibilities	This position will be focusing on IC (integrated circuit) packaging technology research and development, work with global team to finish development projects and other tasks as listed below: - New packaging technology development - New package related process development - Advanced material interface study - Advanced IC package failure analysis - Coordinate/lead development project independently - Communication/cooperation among global teams (US/Germany/Malaysia/Japan/France/etc.) - Understand requirement from internal stakeholders and external customers and create/align project scope
Requirements	- Master and PhD are preferred - Or bachelor degree with at least 5 years experience in packaging industry - Overseas degree that is matching the requirement of this position is preferred - At least CET-6 degree or equivalent English level - Majored in metallography related subject, preferred if familiar with Au-Al alloy in electronic packaging industry - Intention and capability to work in a cross-functional/global team environment - Independent R&D capability Preference: - Experience in R&D work of packaging technology - Experience in material analysis - Excellent English communication skill
Update	2010-03-01 10:30:42
Position Apply	zhaopin@bdwcn.com

Tel:86-22-28370478